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Title:
LINEAR POLISHING MACHINE
Document Type and Number:
WIPO Patent Application WO/2022/143526
Kind Code:
A1
Abstract:
A linear polishing machine, comprising: a polishing disc (200) for fixing a member (100) to be polished, a power mechanism located above the polishing disc (200), and a grinding pad (330) in transmission connection with the power mechanism; wherein the power mechanism is used for driving the grinding pad (330), so that the grinding pad (330) directly contacts and grinds said member (100). The linear polishing machine of the present invention has a novel design and high practicability.

Inventors:
WU MENGYU (CN)
Application Number:
PCT/CN2021/141632
Publication Date:
July 07, 2022
Filing Date:
December 27, 2021
Export Citation:
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Assignee:
GUANGZHOU ADVANCED SEMICONDUCTOR TECH CO LTD (CN)
International Classes:
B24B37/10; B24B21/00
Foreign References:
CN205734295U2016-11-30
JP2003080451A2003-03-18
CN2413848Y2001-01-10
CN106926118A2017-07-07
TW201912299A2019-04-01
JPH081503A1996-01-09
CN102084466A2011-06-01
Attorney, Agent or Firm:
SHENZHEN STANDARD PATENT & TRADEMARK AGENT LTD. (CN)
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