Title:
LINEAR STRUCTURE AND METHOD FOR CONSTRUCTING LINEAR STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/120153
Kind Code:
A1
Abstract:
[Problem] To reduce the maximum settlement amount and relative settlement amount when ground improvement depth below the ground surface is reduced in a linear structure on soft ground, the upper surface of which is used as a road or a railroad. [Solution] A linear structure A comprises a foundation structure 1 below the ground surface GL and an embankment structure 2 on a foundation structure 1. The foundation structure 1 is a foundation ground improvement body 3 in which a ground improvement has been made to the surface layer of soft ground S. The foundation ground improvement body 3 includes a grid-form ground improvement body 4 of which a lower end face 4A reaches a predetermined depth H1 (≦4 m) below the ground surface GL. The embankment structure 2 is an embankment ground improvement body 5 obtained by mixing and agitating the embankment itself, which is good-quality soil, and a solidifying material, and making a ground improvement to the embankment, which is good-quality soil.
Inventors:
TAKEUCHI KINJI (JP)
Application Number:
PCT/JP2022/044862
Publication Date:
June 29, 2023
Filing Date:
December 06, 2022
Export Citation:
Assignee:
TAKEUCHI CONSTRUCTION CO LTD (JP)
International Classes:
E01C3/00; E02D3/12
Domestic Patent References:
| WO2015037249A1 | 2015-03-19 |
Foreign References:
| JP2000212949A | 2000-08-02 | |||
| JP2006057242A | 2006-03-02 | |||
| JP2020002643A | 2020-01-09 |
Attorney, Agent or Firm:
YANAGINO IP, P.C. (JP)
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