Title:
LINEAR SYSTEM AND METHOD FOR INSPECTING SOLDER JOINT QUALITY OF WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2020/215585
Kind Code:
A1
Abstract:
Provided is a linear system and method for inspecting solder joint quality of a workpiece (2). The method for inspecting solder joint quality of the workpiece (2) comprises the following steps: S1: obtaining an image of the workpiece (2) having solder joints; obtaining position information of a solder joint on the workpiece (2) according to the image obtained in S1; S3: driving a solder joint inspection instrument (8) to move to the location of the solder joint; and S5: driving the solder joint inspection instrument (8) to rotate around the solder joint, so as to obtain solder quality data of the solder joint. The invention implements automated solder quality inspection for solder joints, and resolves the issues of low efficiency, poor consistency, and high costs of manual inspection.
Inventors:
WANG PENG (CN)
SUN JIA (CN)
SHEN ZHOU (CN)
HUANG YIKUN (CN)
SUN JIA (CN)
SHEN ZHOU (CN)
HUANG YIKUN (CN)
Application Number:
PCT/CN2019/104622
Publication Date:
October 29, 2020
Filing Date:
September 06, 2019
Export Citation:
Assignee:
INST AUTOMATION CAS (CN)
International Classes:
G01N21/95; G01N23/00; G01N29/00
Foreign References:
| CN110044920A | 2019-07-23 | |||
| CN109387569A | 2019-02-26 | |||
| CN109254004A | 2019-01-22 | |||
| CN104002054A | 2014-08-27 | |||
| CN105675634A | 2016-06-15 | |||
| CN106383166A | 2017-02-08 | |||
| JPH0875669A | 1996-03-22 |
Attorney, Agent or Firm:
HENYOL INTELLECTUAL PROPERTY LAW CORPORATION (CN)
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