Title:
LINK MECHANISM
Document Type and Number:
WIPO Patent Application WO/2019/220709
Kind Code:
A1
Abstract:
[Problem] To provide a link mechanism capable of moving a tip mostly linearly by a simpler structure. [Solution] A link mechanism is provided with: a first parallel link mechanism that has a fixed link and an intermediate link parallel to each other and a pair of side links parallel to each other; a second parallel link mechanism that has a fixed link and an intermediate link parallel to each other and a pair of side links parallel to each other, the fixed link being connected to the intermediate link of the first parallel link mechanism; a fixing structure that is configured by including the intermediate link of the first parallel link mechanism and the fixed link of the second parallel link mechanism; and a connection link that connects one of the side links of the first parallel link mechanism to one of the side links of the second parallel link mechanism.
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Inventors:
HONGO KAZUO (JP)
MASUDA HIROMASA (JP)
MASUDA HIROMASA (JP)
Application Number:
PCT/JP2019/004927
Publication Date:
November 21, 2019
Filing Date:
February 13, 2019
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
F16H21/10; B25J15/08
Domestic Patent References:
| WO2013069118A1 | 2013-05-16 |
Foreign References:
| JP2007091387A | 2007-04-12 | |||
| JP2016068192A | 2016-05-09 | |||
| EP3248737A1 | 2017-11-29 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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