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Patent Searching and Data


Title:
LIQUID BLOW MOLDING APPARATUS AND LIQUID BLOW MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/174809
Kind Code:
A1
Abstract:
A liquid blow molding apparatus (1) is provided with: a blow molding mold (8) that accommodates a preform (3) so as not to include a mouth part (3a) serving as an opening end thereof; a blow nozzle (10) that supplies a pressurized liquid into the preform (3); a partition wall member (22) that tightly surrounds the periphery of an outer wall surface of the mouth part (3a) of the preform (3) and forms a mouth-outside pressurization space (20) between the outer wall surface and the partition wall member (22); and pressurized fluid supply means (24) for supplying a pressurized fluid into the mouth-outside pressurization space (20) so that the pressure inside the mouth-outside pressurization space (20) becomes higher than the pressure inside the preform (3).

Inventors:
SUYAMA KENICHI (JP)
OKUYAMA YUICHI (JP)
Application Number:
PCT/JP2016/001397
Publication Date:
November 03, 2016
Filing Date:
March 11, 2016
Export Citation:
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Assignee:
YOSHINO KOGYOSHO CO LTD (JP)
SUYAMA KENICHI (JP)
OKUYAMA YUICHI (JP)
International Classes:
B29C49/46; B29C49/06; B65D1/00
Foreign References:
JP2013132884A2013-07-08
JP2013208839A2013-10-10
JP2014069441A2014-04-21
JP2011527246A2011-10-27
JP2014028485A2014-02-13
Other References:
See also references of EP 3292984A4
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
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