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Patent Searching and Data


Title:
LIQUID BLOW MOLDING APPARATUS AND LIQUID BLOW MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/079080
Kind Code:
A1
Abstract:
This liquid blow molding apparatus is provided with: a mold (4) in which a preform (2) is arranged; and a nozzle unit (6) that has a supply port (9) through which a liquid can be supplied from above into the preform (2) arranged in the mold (4), wherein the nozzle unit (6) is provided with a seal body (13) that is movable among a closed position where supplying of the liquid through the supply port (9) is blocked, a first open position where supplying of the liquid through only a part, in the circumferential direction, of the supply port (9) is permitted, and a second open position where supplying of the liquid through the entire part, in the circumferential direction, of the supply port (9) is permitted.

Inventors:
TABATA SHINICHI (JP)
SHIOKAWA MITSURU (JP)
Application Number:
PCT/JP2017/031832
Publication Date:
May 03, 2018
Filing Date:
September 04, 2017
Export Citation:
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Assignee:
YOSHINO KOGYOSHO CO LTD (JP)
International Classes:
B29C49/46; B29C49/06; B29C49/66
Domestic Patent References:
WO2017090339A12017-06-01
Foreign References:
JP2016527105A2016-09-08
US6514451B12003-02-04
JPH05254000A1993-10-05
JPS5486561A1979-07-10
Other References:
See also references of EP 3533586A4
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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