Title:
LIQUID BLOW MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/150701
Kind Code:
A1
Abstract:
A liquid blow molding device (1) is for supplying a liquid (L) that has been pressurized into a preform (2) and blow-molding same into a container (C) of a predetermined shape, wherein the liquid blow molding device (1) comprises: a supply block (21) provided with a supply channel (23) for the liquid (L); a blow nozzle (22) that is detachably mounted onto the supply block (21) so as to communicate with an outlet (24) of the supply channel (23); a pressurized liquid supply unit (60) for supplying pressurized liquid (L) to the blow nozzle (22) via the supply channel (23); an annular sealing surface (26) that is provided to a portion of a space between an inner peripheral surface (23a) and the outlet (24) forming the supply channel (23) of the supply block (21), and that surrounds the entire circumference of the outlet (24); and a sealing body (40) that is arranged on the interior of the supply channel (23) and freely moves between a closing position at which the sealing body abuts against the sealing surface (26) and closes the outlet (24), and an opening position at which the sealing body is distant from the sealing surface (26) and opens the outlet (24).
Inventors:
SHIOKAWA MITSURU (JP)
HOSHINO HIDEAKI (JP)
OKUYAMA YUICHI (JP)
HOSHINO HIDEAKI (JP)
OKUYAMA YUICHI (JP)
Application Number:
PCT/JP2018/042025
Publication Date:
August 08, 2019
Filing Date:
November 13, 2018
Export Citation:
Assignee:
YOSHINO KOGYOSHO CO LTD (JP)
International Classes:
B29C49/46; B29C49/12
Foreign References:
| JP2018001575A | 2018-01-11 | |||
| JPH09118314A | 1997-05-06 | |||
| JP2017196872A | 2017-11-02 |
Other References:
See also references of EP 3747621A4
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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