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Title:
LIQUID BLOW MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/150701
Kind Code:
A1
Abstract:
A liquid blow molding device (1) is for supplying a liquid (L) that has been pressurized into a preform (2) and blow-molding same into a container (C) of a predetermined shape, wherein the liquid blow molding device (1) comprises: a supply block (21) provided with a supply channel (23) for the liquid (L); a blow nozzle (22) that is detachably mounted onto the supply block (21) so as to communicate with an outlet (24) of the supply channel (23); a pressurized liquid supply unit (60) for supplying pressurized liquid (L) to the blow nozzle (22) via the supply channel (23); an annular sealing surface (26) that is provided to a portion of a space between an inner peripheral surface (23a) and the outlet (24) forming the supply channel (23) of the supply block (21), and that surrounds the entire circumference of the outlet (24); and a sealing body (40) that is arranged on the interior of the supply channel (23) and freely moves between a closing position at which the sealing body abuts against the sealing surface (26) and closes the outlet (24), and an opening position at which the sealing body is distant from the sealing surface (26) and opens the outlet (24).

Inventors:
SHIOKAWA Mitsuru (KANAGAWA TECHNICAL CENTER, 380, Sannomiy, Isehara-shi Kanagawa 03, 〒2591103, JP)
HOSHINO Hideaki (KANAGAWA TECHNICAL CENTER, 380, Sannomiy, Isehara-shi Kanagawa 03, 〒2591103, JP)
OKUYAMA Yuichi (FUNDAMENTAL TECHNOLOGY & RESEARCH CENTER, 380, Sannomiy, Isehara-shi Kanagawa 03, 〒2591103, JP)
Application Number:
JP2018/042025
Publication Date:
August 08, 2019
Filing Date:
November 13, 2018
Export Citation:
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Assignee:
YOSHINO KOGYOSHO CO., LTD. (2-6 Ojima 3-chome, Koto-ku Tokyo, 31, 〒1368531, JP)
International Classes:
B29C49/46; B29C49/12
Foreign References:
JP2018001575A2018-01-11
JPH09118314A1997-05-06
Attorney, Agent or Firm:
SUGIMURA Kenji (36F Kasumigaseki Common Gate West, 3-2-1 Kasumigasek, Chiyoda-ku Tokyo 13, 〒1000013, JP)
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