Title:
LIQUID COMPOSITION USED IN ETCHING MULTILAYER FILM CONTAINING COPPER AND MOLYBDENUM, MANUFACTURING METHOD OF SUBSTRATE USING SAID LIQUID COMPOSITION, AND SUBSTRATE MANUFACTURED BY SAID MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/175071
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a liquid composition used in etching a multilayer film containing copper and molybdenum, an etching method for etching a multilayer film containing copper and molybdenum, and a substrate. In the present invention, a liquid composition is used which has a pH value between 4-9 and contains (A) a maleic acid ion source, (B) a copper ion source, and (C) at least one species of amine compound selected from the group consisting of 1-amino-2-propanol, 2-(methylamino)ethanol, 2-(ethylamino)ethanol, 2-(butylamino)ethanol, 2-(demethylamino)ethanol, 2-(diethylamino)ethanol, 2-methoxyethylamine, 3-methoxypropylamine, 3-amino-1-propanol, 2-amino-2-methyl-1-propanol, 1-dimethylamino-2-propanol, 2-(2-amino ethoxy)ethanol, morpholine, and 4-(2-hydroxyethyl)morpholine.
Inventors:
TAMAI SATOSHI (JP)
YUBE KUNIO (JP)
YUBE KUNIO (JP)
Application Number:
PCT/JP2014/060325
Publication Date:
October 30, 2014
Filing Date:
April 09, 2014
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C09K13/00; C23F1/14; H01L21/306; H01L21/308; H01L21/3205; H01L21/3213; H01L21/768; H01L23/532
Domestic Patent References:
| WO2013005631A1 | 2013-01-10 | |||
| WO2011099624A1 | 2011-08-18 | |||
| WO2013015322A1 | 2013-01-31 |
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
Kobayashi 浩 (JP)
Kobayashi 浩 (JP)
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