Title:
LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/047702
Kind Code:
A1
Abstract:
The present invention provides a liquid compression molding material which is composed of an epoxy resin composition that contains (A) an epoxy resin, (B) a curing accelerator, (C) a filler and (D) an elastomer, wherein the blending ratio of the filler (C) relative to the epoxy resin composition is 73.0% by mass or more and the blending ratio of the elastomer (D) relative to the total amount of the components of the epoxy resin composition excluding the filler (C) is 7.0% by mass or more.
Inventors:
SAITO YU (JP)
OE TAKAYUKI (JP)
KAMIMURA TSUYOSHI (JP)
OE TAKAYUKI (JP)
KAMIMURA TSUYOSHI (JP)
Application Number:
PCT/JP2022/021246
Publication Date:
March 30, 2023
Filing Date:
May 24, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H01L23/29; B29C43/18; B29C43/34; C08K3/36; C08L9/06; C08L63/00; H01L23/31
Domestic Patent References:
| WO2018221682A1 | 2018-12-06 |
Foreign References:
| JP2008274083A | 2008-11-13 | |||
| JP2009155431A | 2009-07-16 |
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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