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Title:
LIQUID CONCENTRATE OF COMPOSITION FOR ROUGH-POLISHING SILICON WAFERS
Document Type and Number:
WIPO Patent Application WO/2018/025655
Kind Code:
A1
Abstract:
Provided is a liquid concentrate of a composition for rough-polishing silicon wafers, which, when being diluted, is able to deliver preferable polishing performance, and which exhibits excellent stability. The liquid concentrate of a composition for rough-polishing silicon wafers provided by the present invention comprises abrasive particles, a basic compound, and a water-soluble polymer, wherein the ratio [rg/d] of the radius of gyration rg [nm] of the water-soluble polymer to the inter-particle distance d [nm] of the abrasive particles is 4.7 or less.

Inventors:
MURASE, Takehiko (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
TANIGUCHI, Megumi (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
NUMATA, Keisuke (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
AKIZUKI, Reiko (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
TSUCHIYA, Kohsuke (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
Application Number:
JP2017/026405
Publication Date:
February 08, 2018
Filing Date:
July 21, 2017
Export Citation:
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Assignee:
FUJIMI INCORPORATED (1-1 Chiryo 2-chome, Nishibiwajima-cho Kiyosu-sh, Aichi 02, 〒4528502, JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
ABE, Makoto (Kyodo Patent Law Firm, BPR Place Hisaya-Odori 3-20-3, Marunouchi, Naka-ku, Nagoya-sh, Aichi 02, 〒4600002, JP)
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