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Patent Searching and Data


Title:
LIQUID-COOLED HEAT SINK, AND PROCESSING AND ASSEMBLY METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/197789
Kind Code:
A1
Abstract:
A liquid-cooled heat sink, and a processing and assembly method therefor, said method comprising the following steps: milling out curved grooves (31a) on bottom surfaces of a plurality of heat sink single plate blanks, and forming a plurality of heat sink single plates (31) having bottom surfaces provided with the curved grooves (31a); according to the shape of the curved groove (31a) of each heat sink single plate, performing corresponding bending processing on copper tubes arranged to be mounted on the plurality of heat sink single plates (31) and to transmit a cooling liquid, and forming curved copper tubes (32) which can be mounted into the curved grooves of the plurality of heat sink single plates; loading the curved copper tubes (32) having undergone softening processing into the curved grooves of the plurality of heat sink single plates, and forming a liquid-cooled heat sink wherein the plurality of heat sink single plates are connected in series and a bottom portion of each heat sink single plate is smooth.

Inventors:
CAO SHUICHUN (CN)
GAO LEI (CN)
Application Number:
PCT/CN2016/082248
Publication Date:
December 15, 2016
Filing Date:
May 16, 2016
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
H01L23/473; B23P15/26
Foreign References:
CN201393359Y2010-01-27
CN104681515A2015-06-03
CN2578982Y2003-10-08
DE102011012822A12012-09-06
Attorney, Agent or Firm:
AFD CHINA INTELLECTUAL PROPERTY LAW OFFICE (CN)
北京安信方达知识产权代理有限公司 (CN)
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