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Patent Searching and Data


Title:
LIQUID COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/246229
Kind Code:
A1
Abstract:
A liquid cooling device, comprising: a housing (1) having an accommodating chamber (11) and a cooling component (2) accommodated in the accommodating chamber (11). The housing (1) has assembly seams (12) being in communication with the accommodating chamber (11). The outer side of the cooling component (2) abuts against chamber walls of the accommodating chamber (11). Sealant storage grooves (21) are provided in the outer side of the cooling component (2), the sealant storage grooves (21) being arranged opposite to the assembly seams (12), and the sealant storage grooves (21) and the assembly seams (12) being both filled with a sealant. The sealant storage grooves (21) of the cooling component (2) and the assembly seams (12) of the housing are filled with a sealant, so that the assembly seams (12) can be sealed by the sealant so as to prevent condensation water from entering the accommodating chamber (11) through the assembly seams (12), and further dispensing in the assembly seams (12) is facilitated and sufficient sealant can be stored in the sealant storage grooves (21), thereby improving the sealing and waterproof effects of the sealant.

Inventors:
ZHAO HAIZHOU (CN)
LI PENG (CN)
LU JIANWEN (CN)
YANG RUIGUO (CN)
LONG JUNPING (CN)
Application Number:
PCT/CN2023/085924
Publication Date:
December 28, 2023
Filing Date:
April 03, 2023
Export Citation:
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Assignee:
JIANGSU YINGFEIYUAN SMART ENERGY CO LTD (CN)
International Classes:
F28D21/00; F28F11/00; H01M10/613; H05K7/20
Foreign References:
CN217785930U2022-11-11
CN105870509A2016-08-17
CN210088534U2020-02-18
CN105895988A2016-08-24
CN208819953U2019-05-03
CN210351831U2020-04-17
JP2004031417A2004-01-29
JP2004072881A2004-03-04
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY FIRM (CN)
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