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Patent Searching and Data


Title:
LIQUID CRYSTAL MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/042787
Kind Code:
A1
Abstract:
A resin layer (3) is provided on the outside of a sealing material (23) so as to cover the sealing material (23), and the resin layer (3) and the sealing material (23) are bonded to each other in an integrated manner. In this manner, the sealing material (23) is supported from the outside by the resin layer (3) to increase the sealing strength of the sealing material (23).

Inventors:
WATANABE HISASHI
Application Number:
PCT/JP2011/005291
Publication Date:
April 05, 2012
Filing Date:
September 20, 2011
Export Citation:
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Assignee:
SHARP KK (JP)
WATANABE HISASHI
International Classes:
G02F1/1333; G09F9/30
Foreign References:
JP2010009017A2010-01-14
JPH11174417A1999-07-02
JP2006330059A2006-12-07
JPH0675209A1994-03-18
JP2004302133A2004-10-28
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (JP)
Hiroshi Maeda (JP)
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