LIQUID CRYSTAL POLYMER FILM BASED COPPER-CLAD LAMINATE, AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2012/117850

A1

Provided is a liquid crystal polymer film based copper-clad laminate characterized in that one surface or both surfaces of a liquid crystal polymer film has a nitrogen atom content of 10 atomic percent or more, and a metal conductor layer formed by dry plating and/or wet plating is provided on the surface of the liquid crystal polymer film having the nitrogen atom content of 10 atomic percent or more. The liquid crystal polymer film based copper-clad laminate is characterized in that the surface roughness of the liquid crystal polymer film is an arithmetic average roughness (Ra) of 0.15 μm or less and a root-mean-square roughness (Rq) of 0.20 μm or less. A method for producing a liquid crystal polymer film based copper-clad laminate is characterized in that the surface of the liquid crystal polymer film is plasma-treated under a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa, and thereafter, the metal conductor layer is formed by dry plating and/or wet plating.

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SAKAGUCHI KAZUHIKO (JP)
INAZUMI HAJIME (JP)
YACHI HISAKAZU (JP)

PCT/JP2012/053454

September 07, 2012

February 15, 2012

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JX NIPPON MINING & METALS CORP (JP)
SAKAGUCHI KAZUHIKO (JP)
INAZUMI HAJIME (JP)
YACHI HISAKAZU (JP)

B32B15/09; C08J7/00

WO2008090654A1

2008-07-31

JP2003221456A	2003-08-05
JP2005290370A	2005-10-20
JP2005297405A	2005-10-27
JP2002501986A	2002-01-22
JP2001049002A	2001-02-20
JP2005297405A	2005-10-27

See also references of EP 2682264A4

OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)

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