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Patent Searching and Data


Title:
LIQUID CRYSTALLINE RESIN COMPOSITION FOR SURFACE-MOUNTED RELAYS AND SURFACE-MOUNTED RELAY USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/116889
Kind Code:
A1
Abstract:
Provided are: a liquid crystalline resin composition for surface-mounted relays, that provides a molded article that has excellent heat resistance, suppressed blister occurrences and filler desorption, and is capable of being adhered at a high adhesion strength by an adhesive; a component for surface-mounted relays, using same; and a surface-mounted relay. This liquid crystalline resin composition for surface-mounted relays includes a liquid crystalline polymer (A) and a fibrous filler (B). The liquid crystalline polymer (A) is a wholly aromatic polyester amide comprising a prescribed amount of constituent units (I)–(V) as essential constituent components thereof and exhibiting optical anisotropy during melting. The fibrous filler (B) has a weight-average fiber length of 50–170 µm and contains at least 70% by mass of a fraction having a fiber length 20–200 µm. The surface-mounted relay comprises a base and a terminal protruding from the base. The terminal is soldered on to a printed circuit board.

Inventors:
FUKATSU Hiroki (973, Miyajima, Fuji-sh, Shizuoka 33, 〒4168533, JP)
TAKI Tomohiro (973, Miyajima, Fuji-sh, Shizuoka 33, 〒4168533, JP)
Application Number:
JP2017/044425
Publication Date:
June 28, 2018
Filing Date:
December 11, 2017
Export Citation:
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Assignee:
POLYPLASTICS CO., LTD. (2-18-1, Konan Minato-k, Tokyo 80, 〒1088280, JP)
International Classes:
C08L77/12; C08G69/44; C08K7/02; C08K7/14; H01H45/02
Domestic Patent References:
WO2017068869A12017-04-27
WO2013115168A12013-08-08
WO1998056578A11998-12-17
Foreign References:
JP6133000B12017-05-24
JP2005060455A2005-03-10
JPS6357634A1988-03-12
JP2010138228A2010-06-24
JP2013098313A2013-05-20
JP2016014137A2016-01-28
JPH06263857A1994-09-20
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (Sapia Tower, 1-7-12 Marunouchi, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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