LIQUID CURABLE RESIN COMPOSITION, CURED FILM AND MULTILAYER BODY

WIPO Patent Application WO/2005/090470

A1

Disclosed is a liquid curable resin composition containing (A) a fluorine-containing polymer having a hydroxyl group and/or a fluorine-containing polymer having an ethylenically unsaturated group, (B) a curable compound, (C) a curing catalyst, (D) silicon dioxide particles having a number-average particle diameter of not more than 100 nm and (E) a solvent having an sp value of more than 8.5 and less than 12.8. When this liquid curable resin composition is applied to a base and the solvent is removed therefrom, the coating is separated into two layers, namely a layer wherein silicon dioxide exists at high density and a layer wherein substantially no silicon dioxide exists. By curing this coating, there can be obtained a cured film which has excellent adhesion to the base, high abrasion resistance and good antireflection effects.

WO/2005/095478	METHACRYLIC RESIN COMPOSITION
JP2008058348	POLARIZER PROTECTION FILM
JP2752707	[Title of Invention] Polymer film

SHIMOMURA HIROOMI (JP)
DOIMOTO MITSUNOBU (JP)
YAMAMURA TETSUYA (JP)
TANABE TAKAYOSHI (JP)
TAKASE HIDEAKI (JP)

PCT/JP2005/004661

September 29, 2005

March 16, 2005

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JSR CORP (JP)
SHIMOMURA HIROOMI (JP)
DOIMOTO MITSUNOBU (JP)
YAMAMURA TETSUYA (JP)
TANABE TAKAYOSHI (JP)
TAKASE HIDEAKI (JP)

B32B27/30; C08K3/36; C08L27/12; C09D7/00; C09D127/12; G02B1/04; G02B1/11; G02B1/111; G02B1/14; C08K5/00; (IPC1-7): C08L27/12; B32B27/30; C08K3/36; C08K5/00

JP2003261797A	2003-09-19
JP2000109694A	2000-04-18
JPH10339971A	1998-12-22
JP2004317734A	2004-11-11

Watanabe, Kihei (3rd Floor 26, Kanda Suda-cho 1-chom, Chiyoda-ku Tokyo 41, JP)

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