Title:
LIQUID EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING LIQUID EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/093148
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a liquid semiconductor sealing agent which has excellent injectability into a flip-chip semiconductor device having a fine-pitch wiring pattern, and which suppresses fillet cracks after curing.
A liquid epoxy resin composition which is characterized by containing (A) a liquid epoxy resin containing an aminophenol epoxy resin, (B) an amine-based curing agent, (C) a silica filler and (D) a silane coupling agent, and which is also characterized in that: 10.0-70 parts by mass of the aminophenol epoxy resin is contained per 100 parts by mass of the component (A); the component (B) is at an equivalent ratio of 0.7-1.2 relative to 1 equivalent of the component (A); and the liquid epoxy resin composition has a glass transition temperature of 110-200°C after curing.
Inventors:
SUZUKI MAKOTO (JP)
YOSHII HARUYUKI (JP)
KOHARA KAZUYUKI (JP)
YOSHII HARUYUKI (JP)
KOHARA KAZUYUKI (JP)
Application Number:
PCT/JP2015/084025
Publication Date:
June 16, 2016
Filing Date:
December 03, 2015
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08G59/50; C08G59/32; C08L63/00; H01L21/60
Foreign References:
| JP2012162585A | 2012-08-30 | |||
| JP2013001811A | 2013-01-07 | |||
| JP2006016429A | 2006-01-19 | |||
| JP2014227465A | 2014-12-08 |
Attorney, Agent or Firm:
WATARAI YUSUKE (JP)
Yuusuke Watarai (JP)
Yuusuke Watarai (JP)
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