Title:
LIQUID-FILLED LED LAMP
Document Type and Number:
WIPO Patent Application WO/2017/049680
Kind Code:
A1
Abstract:
A liquid-filled LED lamp characterized by mainly comprising a rear cover plate (40), a PCB lamp plate (30), a packaging liquid, a transparent window body (10), and a grid body (20). The rear cover plate (40), the transparent window body (10) and the grid body (20) form a sealed space from a back surface, a side surface and a top surface. The PCB lamp plate (30) is mounted in the sealed space. A pouring orifice is processed on the surface of the grid body (20) and is communicated with the sealed space. A packaging liquid is poured into the whole sealed space. The pouring orifice is plugged outside. According to an LED lamp filled and packaged by heat conduction liquid, a chip (31) is disposed on a whole substrate. After direct potting of the heat conduction liquid, heat generated a light-emitting process is dissipated in multiple directions comprising a front surface, a side surface, and a back surface, can be conducted within shorter time, so that heat is effectively dissipated, thereby avoiding a high temperature that is caused by heat accumulation and that damages the LED chip (31); the light-emitting performance of the LED chip (31) is improved, the light-emitting efficiency is improved. The LED lamp has the characteristics of simple technology and high reliability.
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Inventors:
LI FENG (CN)
Application Number:
PCT/CN2015/091992
Publication Date:
March 30, 2017
Filing Date:
October 15, 2015
Export Citation:
Assignee:
LI FENG (CN)
International Classes:
F21S2/00; H01L33/64
Foreign References:
| CN104763903A | 2015-07-08 | |||
| CN102297351A | 2011-12-28 | |||
| CN102130111A | 2011-07-20 | |||
| US20060138621A1 | 2006-06-29 |
Other References:
See also references of EP 3355371A4
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