Title:
LIQUID FLOW SENSOR THERMAL INTERFACE METHODS AND SYSTEMS
Document Type and Number:
WIPO Patent Application WO2005050142
Kind Code:
A3
Abstract:
A sensor method and system are disclosed. A fluid flow sensor can be provided, which measures the thermal conductivity of a fluid. The sensor itself can be configured to comprimise one or more sensing element associated with sensor substrate. A heater can be associated with a said sensor wherein said heater provides heat to said fluid. A film component can also be provided that that isolates said fluid from said heater and said sensor, such that said film component conducts heat in a direction from said heater to said sensor, thereby forming a thermal coupling between said sensor, said heater and said fluid, which permits said sensor to determine a composition of said fluid by measuring thermal conductivity thereof without undersired losses of heat in other directions. The film component can be configured on or in the shaped of a tubing or a flow channel.
Inventors:
GEHMAN RICHARD W (US)
SPELDRICH BRIAN D (US)
ALDERMAN RICHARD A (US)
SPELDRICH BRIAN D (US)
ALDERMAN RICHARD A (US)
Application Number:
PCT/US2004/038397
Publication Date:
August 04, 2005
Filing Date:
November 12, 2004
Export Citation:
Assignee:
HONEYWELL INT INC (US)
GEHMAN RICHARD W (US)
SPELDRICH BRIAN D (US)
ALDERMAN RICHARD A (US)
GEHMAN RICHARD W (US)
SPELDRICH BRIAN D (US)
ALDERMAN RICHARD A (US)
International Classes:
G01F1/684; G01N25/18; (IPC1-7): G01F1/684
Foreign References:
| US4833912A | 1989-05-30 | |||
| GB1312828A | 1973-04-11 | |||
| US5175527A | 1992-12-29 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 016, no. 568 (P - 1458) 9 December 1992 (1992-12-09)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 02 29 February 2000 (2000-02-29)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 02 29 February 2000 (2000-02-29)
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