Title:
LIQUID IMMERSION COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/042738
Kind Code:
A1
Abstract:
A liquid immersion cooling device that cools a heating element provided on a substrate, the liquid immersion cooling device comprising: a casing that houses the substrate inside and stores a refrigerant in the lower part of the inside; a cover that surrounds at least the heating element and has an opening in at least a portion; a condensing section provided above the liquid level of the refrigerant in the casing to condense the evaporated refrigerant; a refrigerant receiving section provided above the liquid level and below the condensing section and receiving the liquid-phase refrigerant condensed by the condensing section; and a refrigerant introduction channel that guides the refrigerant received in the refrigerant receiving section into the cover.
Inventors:
KAFUKU HIDETAKA (JP)
HARA NOBUHIDE (JP)
FUJII SHUJI (JP)
OGAWA NAOKI (JP)
TSUKAMOTO TAISUKE (JP)
KANAMORI KOHEI (JP)
OKAMOTO SHINICHI (JP)
HARA NOBUHIDE (JP)
FUJII SHUJI (JP)
OGAWA NAOKI (JP)
TSUKAMOTO TAISUKE (JP)
KANAMORI KOHEI (JP)
OKAMOTO SHINICHI (JP)
Application Number:
PCT/JP2023/005782
Publication Date:
February 29, 2024
Filing Date:
February 17, 2023
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
H05K7/20; B01D15/00; F28D15/02; G06F1/20; H01L23/427
Foreign References:
| JPH0354849A | 1991-03-08 | |||
| JPS55120167U | 1980-08-26 | |||
| JPS61215684A | 1986-09-25 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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