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Title:
LIQUID-LEVEL PIPE JOINT AND WAFER CLEANING DEVICE OF ACCURATE LIQUID-LEVEL INFORMATION WITH NO LIQUID
Document Type and Number:
WIPO Patent Application WO/2023/159872
Kind Code:
A1
Abstract:
A liquid level pipe joint and a wafer cleaning device which accurately displays liquid level information when no liquid is present. The structure of the liquid level pipe joint enables an opening of a tank body (1) and an opening of a liquid level pipe (2) to be inclined. The lowest point of an opening of an upper end portion (31) is not higher than an inner wall of the bottom of the tank body (1), so as to enable all liquid to flow away out of the tank body (1). Moreover, by means of puncturing the integrity of the liquid surface by means of the upwardly inclined upper end portion (31), the effect of the surface tension of the liquid is reduced, so that the liquid can be discharged as much as possible.

Inventors:
QIAN CHENG (CN)
LI GANG (CN)
HUO ZHAOJUN (CN)
Application Number:
PCT/CN2022/109015
Publication Date:
August 31, 2023
Filing Date:
July 29, 2022
Export Citation:
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Assignee:
JIANGSU ASIA ELECTRONICS TECH CO LTD (CN)
WUXI ASIA ELECTRONICS INTELLIGENT EQUIPMENT CO LTD (CN)
International Classes:
G01F23/02; B08B13/00; F16L41/08; H01L21/67
Foreign References:
CN114700337A2022-07-05
CN203124380U2013-08-14
CN201867222U2011-06-15
CN215296377U2021-12-24
CN205919870U2017-02-01
KR20210145420A2021-12-02
JP2003042826A2003-02-13
JP2008190954A2008-08-21
Attorney, Agent or Firm:
RUNWEN PATENT LAW FIRM (CN)
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