Title:
LIQUID METAL PRECURSOR SOLUTION, METAL FILM MANUFACTURING METHOD USING SAME, AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2022/211218
Kind Code:
A1
Abstract:
Provided is a liquid metal precursor solution, which comprises: metal precursor particles each including a metal particle and a polymer film enclosing the metal particle; and a solvent mixed with the metal precursor particles, wherein the polymer film and the solvent each contain a functional group having mutual electrostatic repulsion and thus the metal precursor particles are dispersed in the solvent.
Inventors:
PARK STEVE (KR)
KIM HYEONJI (KR)
LEE GUN-HEE (KR)
JEONG JAE-WOONG (KR)
KIM HYEONJI (KR)
LEE GUN-HEE (KR)
JEONG JAE-WOONG (KR)
Application Number:
PCT/KR2021/019066
Publication Date:
October 06, 2022
Filing Date:
December 15, 2021
Export Citation:
Assignee:
KOREA ADVANCED INST SCI & TECH (KR)
International Classes:
C23C26/00; C23C18/08; H01B1/02; H01B5/14; H01L51/00
Domestic Patent References:
| WO1997018341A1 | 1997-05-22 |
Foreign References:
| KR101993813B1 | 2019-06-27 | |||
| KR101787809B1 | 2017-10-18 | |||
| KR101993812B1 | 2019-06-27 | |||
| US20140147959A1 | 2014-05-29 |
Attorney, Agent or Firm:
DAHAI INTERNATIONAL PATENT & LAW FIRM (KR)
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