Title:
LIQUID METAL THERMAL INTERFACE MATERIAL WITH MELT-BACK PROPERTY AND PREPARATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/161416
Kind Code:
A1
Abstract:
The invention discloses a liquid metal thermal interface material with a melt-back property and a preparation method thereof. The liquid metal thermal interface material is characterized by containing in percent by weight: 20-40 wt% of indium, 0-6 wt% of bismuth, 0-2 wt% of antimony, 0-3 wt% of zinc, 0-0.6 wt% of silver, 0-0.3 wt% of nickel, 0-0.8 wt% of cerium, and 0-0.6 wt% of europium, with the balance being tin. The material has excellent thermal conductivity and chemical stability in an insulated gate bipolar transistor IGBT working environment and is very suitable for large-scale industrial production and practical application of IGBT devices.
Inventors:
LIU YAJUN (CN)
CAO HEQUAN (CN)
CAO SHUAI (CN)
GUO QIANG (CN)
WU ZHIXIN (CN)
CAO HEQUAN (CN)
CAO SHUAI (CN)
GUO QIANG (CN)
WU ZHIXIN (CN)
Application Number:
PCT/CN2017/081749
Publication Date:
September 13, 2018
Filing Date:
April 24, 2017
Export Citation:
Assignee:
NINGBO SYRNMA METAL MAT CO LTD (CN)
International Classes:
C22C13/00; C22C1/02; C22C30/06
Foreign References:
| CN101341266A | 2009-01-07 | |||
| US20070071634A1 | 2007-03-29 | |||
| CN203038911U | 2013-07-03 | |||
| CN106373954A | 2017-02-01 | |||
| CN106317887A | 2017-01-11 |
Other References:
See also references of EP 3431621A4
Attorney, Agent or Firm:
BEIJING CLOUD IP LAW FIRM (CN)
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