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Patent Searching and Data


Title:
LIQUID ORGANOSILICON COMPOUND AND THERMOSETTING RESIN COMPOSITION TO WHICH SAME IS ADDED
Document Type and Number:
WIPO Patent Application WO/2019/163686
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a thermosetting resin composition from which a cured product having a high refractive index and good transparency and heat resistance can be obtained. The present invention relates to a liquid organosilicon compound, a method for preparing the same, and a thermosetting resin composition containing said liquid organosilicon compound.

Inventors:
ISHIKAWA KENTARO (JP)
Application Number:
JP2019/005719
Publication Date:
August 29, 2019
Filing Date:
February 15, 2019
Export Citation:
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Assignee:
JNC CORP (〒1008105, JP)
International Classes:
C08G77/20; C08L83/07; C09D183/07; H01L23/29; H01L23/31
Domestic Patent References:
WO2011145638A12011-11-24
WO2017110468A12017-06-29
Foreign References:
JP2010116464A2010-05-27
JP2017014320A2017-01-19
JP2015172146A2015-10-01
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (〒1050003, JP)
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