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Title:
LIQUID PROCESSING NOZZLE, LIQUID PROCESSING METHOD USING SAME, GAS DISSOLUTION METHOD, AND GAS DISSOLUTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/178436
Kind Code:
A3
Abstract:
Provided is a liquid processing nozzle that eliminates the effects of biased flows, thus being able to produce an adequate cavitation effect, and, by extension, a microbubble-generating effect or gas dissolution efficiency. The liquid processing nozzle 1 is provided with: a nozzle body 2 having a liquid passage 3 formed therein; and a processing core CORE comprising a partition wall 8 that partitions the liquid passage 3 into an inflow chamber 6 on a liquid inlet 4 side and an outflow chamber 7 on a liquid outlet 5 side, a plurality of apertures 9 that are formed through the partition wall 8 and allow the inlet chamber 6 and the outlet chamber 7 to communicate with each other via separate passages, and protrusions 10 that protrude from the inner surface of the apertures 9 and are formed on the outer peripheral surface such that a plurality of ridge sections 11 and valley sections 12, which serve as high flow rate sections, alternately extend in the peripheral direction. The aspect ratio of the apertures 9, defined by L/de (where de represents the diameter of a circle equivalent to the total of the axial cross-section area of the apertures 9, and L represents the length of the apertures 9), is set to 3.5 or less; and in a projection on a plane orthogonal to the axis of the nozzle body 2, the smaller the distance T, which represents the distance from a reference point defined by the center position of the projection area of the partition wall 8 to the inner peripheral edge of the plurality of apertures, is than the inner diameter d of the apertures, the closer the apertures 9 are positioned.

Inventors:
KATOU HIROO (JP)
SHIBATUKA MASAHIRO (JP)
KAI HIDEHIRO (JP)
Application Number:
PCT/JP2016/064072
Publication Date:
January 26, 2017
Filing Date:
May 02, 2016
Export Citation:
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Assignee:
WATER DESIGN CORP (JP)
International Classes:
A61H33/00; B01F5/06; A61H33/02; B01F1/00; B01F3/04; B01F5/04; C02F1/20; C02F1/68
Domestic Patent References:
WO2013011570A12013-01-24
WO2013012069A12013-01-24
Foreign References:
JP2012250138A2012-12-20
JP2009082903A2009-04-23
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