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Patent Searching and Data


Title:
LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/221682
Kind Code:
A1
Abstract:
A liquid resin composition for resin molding, including: an aliphatic epoxy compound (A); an epoxy compound (B) having an aromatic ring in the molecules thereof; a nitrogen-containing heterocyclic compound (C); and an inorganic filler (D).

Inventors:
INOUE HIDETOSHI (JP)
MATSUZAKI TAKAYUKI (JP)
TAKAHASHI HISATO (JP)
KAMIMURA TSUYOSHI (JP)
YOSHII HARUYUKI (JP)
Application Number:
PCT/JP2018/021060
Publication Date:
December 06, 2018
Filing Date:
May 31, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
NAMICS CORP (JP)
International Classes:
C08G59/20; C08K3/00; C08K5/5435; C08L63/00; H01L23/29; H01L23/31
Foreign References:
JP2015013950A2015-01-22
JP2006176678A2006-07-06
JP2012060021A2012-03-22
JP2008045123A2008-02-28
JP2012077129A2012-04-19
JP2017039802A2017-02-23
JP2015174906A2015-10-05
JP2003335923A2003-11-28
JP2007023272A2007-02-01
JP2008150555A2008-07-03
JP2014152314A2014-08-25
JP2017108716A2017-06-22
JP2012162585A2012-08-30
JP2013163747A2013-08-22
JP2009221424A2009-10-01
Other References:
See also references of EP 3636688A4
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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