Title:
LIQUID RESIN COMPOSITION AND RESIN-ENCAPSULATED POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2023/234201
Kind Code:
A1
Abstract:
This liquid resin composition is used to encapsulate, by casting, a power module comprising a power module substrate with a circuit layer formed thereon and a power semiconductor element mounted on the circuit layer of the power module substrate. The liquid resin composition includes (A) an epoxy resin, (B) an acid anhydride, (C) a hardening accelerator, (D) an inorganic filler, and (E) a sedimentation preventing agent. The epoxy resin (A) includes an alicyclic epoxy resin. The viscosity of the liquid resin composition at 25°C is 75 Pa•s or less.
Inventors:
TSUNODA TOMOKI (JP)
GO YOSHIYUKI (JP)
INOMATA HARUHIKO (JP)
GO YOSHIYUKI (JP)
INOMATA HARUHIKO (JP)
Application Number:
PCT/JP2023/019658
Publication Date:
December 07, 2023
Filing Date:
May 26, 2023
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H01L23/29; C08G59/42; C08K3/013; C08L63/00; H01L23/31; H01L25/07; H01L25/18
Domestic Patent References:
| WO2021132679A1 | 2021-07-01 | |||
| WO2020250957A1 | 2020-12-17 |
Foreign References:
| JP2016108367A | 2016-06-20 | |||
| JP2018193274A | 2018-12-06 | |||
| JP2018165333A | 2018-10-25 | |||
| JP2016191031A | 2016-11-10 | |||
| JP2011057734A | 2011-03-24 | |||
| JP2016000801A | 2016-01-07 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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