Title:
LIQUID RESIN COMPOSITION, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2012/133384
Kind Code:
A1
Abstract:
The present invention provides a liquid sealing resin composition in which warpage of a quasi-wafer causing reduction in productivity in a wafer level package is suppressed. In a two-layered state of a silicon wafer and a hardened material of this liquid resin composition, an internal stress value (σ) obtained from expression (1) is 10 MPa or less (where σ denotes the internal stress value, Eresin(T) denotes the modulus of elasticity of the hardened material of the liquid resin composition at the temperature of T °C, αresin(T) denotes the coefficient of linear expansion of the hardened material of the liquid resin composition at the temperature of T °C, and αsi(T) denotes the coefficient of linear expansion of silicon at the temperature of T °C).
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Inventors:
FUKAMACHI SEIJI (JP)
MASUDA TAKESHI (JP)
MASUDA TAKESHI (JP)
Application Number:
PCT/JP2012/057887
Publication Date:
October 04, 2012
Filing Date:
March 27, 2012
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
FUKAMACHI SEIJI (JP)
MASUDA TAKESHI (JP)
FUKAMACHI SEIJI (JP)
MASUDA TAKESHI (JP)
International Classes:
H01L23/29; C08G59/02; H01L23/31
Foreign References:
| JPH1030050A | 1998-02-03 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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Claims: