Title:
LIQUID SEALING AGENT, ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/062877
Kind Code:
A1
Abstract:
The present invention provides a liquid sealing agent which has good curability and is capable of suppressing molding failure. The present invention provides a liquid sealing agent which contains an epoxy resin, a curing agent, a curing catalyst and a filler, while having a gel time of 100 seconds to 620 seconds at 120°C.
Inventors:
SAKAI YOSUKE (JP)
SUZUKI MAKOTO (JP)
KAMIMURA TSUYOSHI (JP)
SUZUKI MAKOTO (JP)
KAMIMURA TSUYOSHI (JP)
Application Number:
PCT/JP2022/024511
Publication Date:
April 20, 2023
Filing Date:
June 20, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H01L23/29; C08K3/013; C08K5/13; C08K5/34; C08L61/06; C08L63/00; C09K3/10; H01L23/31
Foreign References:
| JP2006176678A | 2006-07-06 | |||
| JP2004087852A | 2004-03-18 | |||
| JP2015178636A | 2015-10-08 |
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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