LIQUID SUPPLYING APPARATUS, POLISHING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

WIPO Patent Application WO/2005/090001

A1

A polishing liquid supplying apparatus (70) is provided for supplying a use point UP (a lower plane of a polishing pad (42)) with a polishing liquid of a required flow volume. The polishing liquid supplying apparatus is provided with a polishing liquid path (72), which guides the polishing liquid pressure fed from a polishing liquid pressure feeding source (71) to the use point UP, a flowmeter (73) for measuring a passing flow volume of the polishing liquid at a middle part of the polishing liquid path (72), a flow volume adjusting valve (74), which is provided in the downstream of the flowmeter (73) and passes the polishing liquid of a flow volume corresponding to an opening degree, and a polishing liquid flow volume controller (75), which adjusts the opening degree of the flow volume adjusting valve (74) corresponding to the polishing liquid passing flow volume measured by the flowmeter (73) and controls the flow volume of the polishing liquid that flows out from the use point UP.

Asada, Naoki (C/O NIKON CORPORATION, 2-3 Marunouchi 3-Chome, Chiyoda-k, Tokyo 31, 10083, JP)

PCT/JP2005/005467

September 29, 2005

March 17, 2005

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NIKON CORPORATION (2-3 Marunouchi 3-Chome, Chiyoda-ku Tokyo, 31, 10083, JP)
Asada, Naoki (C/O NIKON CORPORATION, 2-3 Marunouchi 3-Chome, Chiyoda-k, Tokyo 31, 10083, JP)

B24B37/00; B24B37/04; B24B49/00; B24B57/02; H01L21/304; (IPC1-7): B24B37/00; B24B57/02; H01L21/304

Ohnishi, Shogo (S.OHNISHI & ASSOCIATES, HIGASHI-IKEBUKURO SS BUILDING 1F 3-20-3, Higashi-Ikebukuro, Toshima-k, Tokyo 13, 17000, JP)

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