Title:
LOAD ADJUSTMENT SYSTEM AND LOAD ADJUSTMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2023/085207
Kind Code:
A1
Abstract:
This load adjustment system comprises: a bevel polishing device having a polishing head that polishes a bevel portion of a substrate; and a control device. The control device acquires, from a load measuring device that measures a pressing load from the polishing head, measurement data obtained by the measurement, calculates an adjustment value for adjusting the pressing load, on the basis of the measurement data and a setting parameter set for the polishing head, and controls a pressing operation of the polishing head on the basis of the adjustment value.
Inventors:
TAKENAKA HIROYUKI (JP)
Application Number:
PCT/JP2022/041160
Publication Date:
May 19, 2023
Filing Date:
November 04, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B21/00; B24B9/00; B24B49/10; H01L21/304
Foreign References:
| JP2017185612A | 2017-10-12 | |||
| JP2017094480A | 2017-06-01 | |||
| JP2019058980A | 2019-04-18 | |||
| JP2020120075A | 2020-08-06 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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