LOCALIZED JET SOLDERING DEVICE AND PARTIAL JET SOLDERING METHOD

Title:

LOCALIZED JET SOLDERING DEVICE AND PARTIAL JET SOLDERING METHOD

Document Type and Number:

WIPO Patent Application WO2010110341

Kind Code:

A1

Abstract:

Even when a nozzle with a small aperture is used in a localized jet solder tank, molten solder can be jetted locally and stably into a component mounted member, without lowering the rotational frequency of a pump in said localized jet solder tank which is difficult to set. As shown in figure 3, the localized jet automatic soldering device (100) is provided with a solder tank (4), which has a nozzle base (44) and contains molten solder (7); a pump (5), which brings the molten solder (7) in the solder tank (4) to a predetermined pressure, and supplies said solder (7) to the nozzle base (44); a plurality of nozzles (8a, etc.) with a predetermined solder ejection area connected to the nozzle base (44), and which eject the molten solder (7) supplied by the pump (5) at a predetermined pressure, such that said solder (7) builds up due to surface tension; and a dummy nozzle (32) connected to the nozzle base (44) with a solder ejection area larger than that of said nozzles (8a, etc.), and which ejects molten solder (7) supplied by the pump (5) at a predetermined pressure. The dummy nozzle (32) is disposed at a location closer to the pump (5) than the abovementioned nozzles (8a, etc.).

Inventors:

SATO ISSAKU (JP)
TAKAGUCHI AKIRA (JP)

Application Number:

PCT/JP2010/055125

Publication Date:

September 30, 2010

Filing Date:

March 24, 2010

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)
SATO ISSAKU (JP)
TAKAGUCHI AKIRA (JP)

International Classes:

B23K1/00; H05K3/34; B23K1/08; B23K3/06; B23K101/42

Foreign References:

JPS4949159A	1974-05-13
JP2003078242A	2003-03-14
JP2004009127A	2004-01-15
JP2008109033A	2008-05-08
JP2002368404A	2002-12-20
JP2000200966A	2000-07-18
JP2005028446A	2005-02-03

Other References: