Title:
LOCATING APPARATUS AND METHOD FOR INTEGRATED CIRCUIT REPAIR
Document Type and Number:
WIPO Patent Application WO/2019/219094
Kind Code:
A2
Abstract:
Embodiments of the present application disclose a locating apparatus and method for integrated circuit repair. The integrated circuit repair apparatus comprises an infrared imaging and locating unit and an integrated circuit repair unit; the infrared imaging and locating unit is configured to locate, by means of a near infrared imaging method, failure points on an integrated circuit being tested; the integrated circuit repair unit is configured to repair the circuit at said failure points.
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Inventors:
ZHAO YANG (CN)
ZHU JINHUI (CN)
ZHANG HAIFENG (CN)
SUN CHENJUN (CN)
CHEN YANNING (CN)
ZHAO MINGMIN (CN)
LI JIANQIANG (CN)
YUAN YUANDONG (CN)
ZHU JINHUI (CN)
ZHANG HAIFENG (CN)
SUN CHENJUN (CN)
CHEN YANNING (CN)
ZHAO MINGMIN (CN)
LI JIANQIANG (CN)
YUAN YUANDONG (CN)
Application Number:
PCT/CN2019/094855
Publication Date:
November 21, 2019
Filing Date:
July 05, 2019
Export Citation:
Assignee:
BEIJING SMARTCHIP MICROELECTRONICS TECH CO LTD (CN)
STATE GRID INFORMATION & TELECOMMUNICATION GROUP CO LTD (CN)
STATE GRID CORP CHINA (CN)
STATE GRID HEBEI ELECTRIC POWER CO LTD (CN)
CHINA ELECTRIC POWER RES INST CO LTD (CN)
STATE GRID INFORMATION & TELECOMMUNICATION GROUP CO LTD (CN)
STATE GRID CORP CHINA (CN)
STATE GRID HEBEI ELECTRIC POWER CO LTD (CN)
CHINA ELECTRIC POWER RES INST CO LTD (CN)
International Classes:
H01L21/68; H01L21/66
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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