LOOP HEAT PIPE, MANUFACTURING METHOD FOR SAME, AND ELECTRONIC EQUIPMENT

WIPO Patent Application WO/2017/195254

A1

A loop heat pipe (1) is a structure in which a first plate member (8) is joined to a second plate member (9). The first plate member comprises, in a region serving as an evaporator (2), a plurality of first protrusions (10) extending in the lengthwise direction, a plurality of second protrusions (11) extending in the width direction, and a plurality of first depressions (12) partitioned by the first protrusions and the second protrusions. The second plate member comprises, in a region serving as the evaporator, a plurality of third protrusions (14) extending in the lengthwise direction and/or a plurality of fourth protrusions (15) extending in the width direction, and a plurality of second depressions (16) partitioned by the third protrusions and/or the fourth protrusions. In the region serving as the evaporator, the first plate member and the second plate member are joined so that the first depressions are opposite to the third protrusions and/or the fourth protrusions and so that the first depressions communicate with the second depressions on both sides of the third protrusion and/or the fourth protrusion.

JPS5719592	HEAT PIPE
JP2022139889	LOOPED HEAT PIPE, COOLER, ELECTRONIC DEVICE AND WICK
JP2002190558	METHOD FOR MANUFACTURING HEAT SINK

SHIOGA TAKESHI (JP)
ABE TOMOYUKI (JP)

PCT/JP2016/063762

November 16, 2017

May 09, 2016

Click for automatic bibliography generation  

FUJITSU LTD (JP)

F28D15/02; F28D15/04; H05K7/20

WO2001063195A1	2001-08-30
WO2016051569A1	2016-04-07

JP2015183880A	2015-10-22
JP2007315745A	2007-12-06
JP2005518518A	2005-06-23
JP2013257129A	2013-12-26
CN202329315U	2012-07-11
JP2001336889A	2001-12-07
JP2015059693A	2015-03-30

SANADA, Tamotsu et al. (JP)

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