Title:
LOUDSPEAKER MODULE, AUDIO COMPENSATION METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/070828
Kind Code:
A1
Abstract:
The present invention discloses a loudspeaker module, an audio compensation method and a device, relates to the terminal technical field, and is used for compensating the audio parameters of a device configured with different loudspeaker modules to ensure the consistency of the audio performance of the device. The loudspeaker module comprises an audio component and a loudspeaker attachment plate on which a power contact, a ground contact and a GPIO contact are arranged, and a connecting part is sandwiched between the audio component and the loudspeaker attachment plate. Wherein, the connection state of the GPIO contact is any one of the following states: the connecting part being a conductor, and the GPIO contact being conducted with the power contact through the connecting part; or, the connecting part being a conductor, and the GPIO contact being conducted with the ground contact through the connecting part; or, the connecting part being a non-conductor, and the states between the GPIO contact and the power contact, and between the GPIO contact and the ground contact being all in an off state.
Inventors:
TANG DONG (CN)
Application Number:
PCT/CN2015/092873
Publication Date:
May 04, 2017
Filing Date:
October 26, 2015
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H04R19/00
Foreign References:
| CN1781337A | 2006-05-31 | |||
| CN202134756U | 2012-02-01 | |||
| CN1374719A | 2002-10-16 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT&TRADEMARK AGENT LTD. (CN)
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