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Patent Searching and Data


Title:
LOUDSPEAKER MODULE
Document Type and Number:
WIPO Patent Application WO/2021/000182
Kind Code:
A1
Abstract:
Provided is a loudspeaker module. The loudspeaker module comprises an upper cover plate with a receiving cavity, a lower cover plate, and a loudspeaker unit, wherein the upper cover plate is provided, in an area thereof where the loudspeaker unit is not placed, with a bottom wall of the upper cover plate and a rib which extends from the bottom wall of the upper cover plate toward the lower cover plate; the loudspeaker module further comprises an air-permeable spacer fixed to the rib, wherein the bottom wall of the upper cover plate, the rib, and the air-permeable spacer are jointly enclosed to form an airflow groove body, and the lower cover plate is provided with a baffle; and the loudspeaker module further comprises a reinforcing rib clamped between the baffle and the air-permeable spacer, wherein the baffle, the bottom wall of the lower cover plate and the air-permeable spacer jointly constitute a filling cavity accommodating a sound-absorbing material, and the projection of the baffle along the assembly direction of the upper cover plate and the lower cover plate is located in the range of the airflow groove body, such that the airflow groove body and the receiving cavity, and the airflow groove body and the filling cavity are both in airflow connection by means of the air-permeable spacer.

Inventors:
CHEN ZHICHEN (CN)
Application Number:
CN2019/094082
Publication Date:
January 07, 2021
Filing Date:
June 30, 2019
Export Citation:
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Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECHNOLOGIES PTE LTD (CN)
International Classes:
H04R9/06; H04R1/02
Domestic Patent References:
WO2016165355A12016-10-20
Foreign References:
CN108124225A2018-06-05
CN108462918A2018-08-28
CN107071668A2017-08-18
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY FIRM (CN)
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