Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LOW AC-LOSS MULTI-FILAMENT TYPE SUPERCONDUCTIVE WIRE MATERIAL, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/052736
Kind Code:
A1
Abstract:
Disclosed is a low AC-loss multi-filament type superconductive wire material comprising a lengthy base material, an intermediate layer formed upon this base material, a superconductive layer formed upon this intermediate layer, and a metal stabilizing layer formed upon this superconductive layer. A plurality of slots, running along the longitudinal direction of the aforementioned base material, extending to the aforementioned intermediate layer from the aforementioned metal stabilizing layer via the aforementioned superconductive layer, and exposing the aforementioned intermediate layer, are formed in parallel in the width direction of the aforementioned base material, and the difference (δd = d1 - d2) between the width (d1) of the aforementioned slots at the lower part of the aforementioned superconductive layer, and the width (d2) of the slots at the lower part of the aforementioned metal stabilizing layer is not more than 10 μm.

Inventors:
MACHI TAKATO (JP)
TOBITA HIROSHI (JP)
TAKAHASHI YASUO (JP)
TANABE KEIICHI (JP)
IZUMI TERUO (JP)
Application Number:
PCT/JP2010/069326
Publication Date:
May 05, 2011
Filing Date:
October 29, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
INT SUPERCONDUCTIVITY TECH (JP)
FUJIKURA LTD (JP)
SWCC SHOWA CABLE SYS CO LTD (JP)
MACHI TAKATO (JP)
TOBITA HIROSHI (JP)
TAKAHASHI YASUO (JP)
TANABE KEIICHI (JP)
IZUMI TERUO (JP)
International Classes:
H01B12/06; C01G1/00; C01G3/00; H01B13/00; H01F6/06; H01F36/00
Domestic Patent References:
WO2008079443A22008-07-03
Foreign References:
JP2007080780A2007-03-29
JP2009218008A2009-09-24
JP2007141688A2007-06-07
JP2008243588A2008-10-09
JPH02194567A1990-08-01
JP2009250785A2009-10-29
JP2006236652A2006-09-07
JP2008060074A2008-03-13
JP2007141688A2007-06-07
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ANTIBODY HAVING ACTIVITY OF INHIBITING INFECTION WITH HEPATITIS C VIRUS (HCV) AND USE OF SAME

Next Patent: POLYCARBONATE RESIN COMPOSITION, POLYCARBONATE RESIN MOLDED ARTICLE, AND MANUFACTURING METHOD THEREF...