Title:
LOW ADSORPTION SEALANT FILM, LAYERED BODY, AND PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2020/071315
Kind Code:
A1
Abstract:
[Problem] To provide a sealant film that is less likely to adsorb components formed of various types of organic compounds, has excellent heat sealing characteristics at 140°C, while having low heat sealing strength at 100°C and being less likely for heat sealing layers to adhere to each other even when the film is used as a packaging bag and the content thereof is warmed in boiling water. [Solution] This low adsorption sealant film is characterized by having a heat sealing layer formed of at least one layer of a polyester-based component, and by satisfying (1)-(3) below. (1) The sealing strength when the heat sealing layers are sealed together at 100°C under 0.2 MPa for 2 seconds is 0-5 N/15 mm; (2) the sealing strength when the heat sealing layers are sealed together at 140°C under 0.2 MPa for 2 seconds is 8-30 N/15 mm; and (3) the density of the film containing all the layers is 1.20 or greater but less than 1.39.
Inventors:
MARUYAMA HIROKO (JP)
HARUTA MASAYUKI (JP)
ISHIMARU SHINTARO (JP)
HARUTA MASAYUKI (JP)
ISHIMARU SHINTARO (JP)
Application Number:
PCT/JP2019/038525
Publication Date:
April 09, 2020
Filing Date:
September 30, 2019
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08J5/18; B32B27/36; B65D65/40
Domestic Patent References:
| WO2018150997A1 | 2018-08-23 | |||
| WO2017159582A1 | 2017-09-21 | |||
| WO2014175313A1 | 2014-10-30 |
Foreign References:
| JP2003528746A | 2003-09-30 | |||
| JPH10193547A | 1998-07-28 | |||
| JPH07196899A | 1995-08-01 | |||
| JPH0817846B2 | 1996-02-28 | |||
| JPH07132946A | 1995-05-23 | |||
| JP2017165059A | 2017-09-21 |
Other References:
See also references of EP 3862381A4
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