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Patent Searching and Data


Title:
LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO2004035705
Kind Code:
A3
Abstract:
A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120°C of below about 10,000 centipoises, a cube flow at 130°F (54°C) of less than about 300%, a DSC crystallization temperature of less than about 75°C and a storage modulus of less than about 1.0 x 107 dynes/cm2 at 10 rads/sec (25°C).

Inventors:
PAUL CHARLES W
SHARAK MATTHEW L
LEISA RYAN A
XENIDOU MARIA
HARWELL MICHAEL G
HE QIWEL
Application Number:
PCT/US2003/033278
Publication Date:
June 10, 2004
Filing Date:
October 20, 2003
Export Citation:
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Assignee:
NAT STARCH CHEM INVEST (US)
International Classes:
C09J153/02; D04H1/587; (IPC1-7): C09J153/02
Domestic Patent References:
WO1998002498A11998-01-22
WO1997019582A21997-06-05
Foreign References:
US3932329A1976-01-13
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