Title:
LOW-COST CIRCUIT BOARD MATERIALS AND PROCESSES FOR AREA ARRAY ELECTRICAL INTERCONNECTIONS OVER A LARGE AREA BETWEEN A DEVICE AND THE CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2004/105131
Kind Code:
A1
Abstract:
An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.
Inventors:
Palanisamy, Ponnusamy (133 Claremont Drive, Lansdale, PA, 19446, US)
Application Number:
PCT/US2003/023755
Publication Date:
December 02, 2004
Filing Date:
July 30, 2003
Export Citation:
Assignee:
SARNOFF CORPORATION (201 Washington Road, CN5300 Princeton, NJ, 08543-5300, US)
International Classes:
G02F1/1339; H01J17/28; H01J29/00; H01L51/52; H05K1/14; H05K1/18; H05K7/20; G02F1/133; G02F1/1333; H01L27/32; H05K1/02; H05K3/32; H05K3/34; H05K3/36; (IPC1-7): H01L23/48; H01L23/52; H01L29/40; H01L21/44; H01L21/48; H01L21/50
Attorney, Agent or Firm:
Nigon, Kenneth N. (RatnerPrestia, P.O. Box 980 Valley Forge, PA, 19482, US)