Title:
LOW-DENSITY GEL AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/039541
Kind Code:
A1
Abstract:
The low-density gel disclosed in the present invention has a framework which comprises polysiloxane chains and organic polymer chains, wherein the polysiloxane chains and the organic polymer chains have been bonded to each other by covalent bonding in a plurality of positions on both of these chains, with the silicon atoms of the polysiloxane chains serving as bonding sites. The organic polymer chains may be aliphatic hydrocarbon chains. The polysiloxane chains may be polyorganosiloxane chains. The low-density gel is novel and is improved in mechanical properties including bending flexibility.
Inventors:
NAKANISHI KAZUKI (JP)
KANAMORI KAZUYOSHI (JP)
ZU GUOQING (JP)
KANAMORI KAZUYOSHI (JP)
ZU GUOQING (JP)
Application Number:
PCT/JP2018/031141
Publication Date:
February 28, 2019
Filing Date:
August 23, 2018
Export Citation:
Assignee:
UNIV KYOTO (JP)
International Classes:
C08J9/28; C08G77/42; C08G77/50
Domestic Patent References:
| WO2018097106A1 | 2018-05-31 | |||
| WO2007010949A1 | 2007-01-25 |
Foreign References:
| JP2007519780A | 2007-07-19 | |||
| JP2000230073A | 2000-08-22 | |||
| JP2015212360A | 2015-11-26 | |||
| JP2003128825A | 2003-05-08 | |||
| JP2014061457A | 2014-04-10 | |||
| JP2016069499A | 2016-05-09 |
Other References:
See also references of EP 3674356A4
Attorney, Agent or Firm:
KAMADA Koichi (JP)
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