Title:
LOW DIELECTRIC ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/031342
Kind Code:
A1
Abstract:
Provided is an adhesive composition that is highly adhesive not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, can achieve high solder heat resistance and has excellent low dielectric characteristics.
The adhesive composition comprises component (A) and component (B) together with component (C) and/or component (D):
component (A): a crystalline acid-denatured polyolefin;
component (B): an amorphous polyolefin;
component (C): a carbodiimide resin; and
component (D): an epoxy resin.
Inventors:
MIKAMI TADAHIKO (JP)
ITO TAKESHI (JP)
KASHIHARA KENJI (JP)
SAKATA HIDEYUKI (JP)
ITO TAKESHI (JP)
KASHIHARA KENJI (JP)
SAKATA HIDEYUKI (JP)
Application Number:
PCT/JP2015/066736
Publication Date:
March 03, 2016
Filing Date:
June 10, 2015
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C09J123/26; B32B15/08; B32B15/085; B32B27/00; C09J7/10; C09J11/06; C09J123/02; C09J163/00; C09J179/00; H05K1/03
Domestic Patent References:
| WO2003078488A1 | 2003-09-25 |
Foreign References:
| JPS5490346A | 1979-07-18 | |||
| JPH1060401A | 1998-03-03 | |||
| JP2000104025A | 2000-04-11 | |||
| JP2000345132A | 2000-12-12 | |||
| JPH02253950A | 1990-10-12 |
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