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Title:
LOW-DIELECTRIC ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/230445
Kind Code:
A1
Abstract:
Provided is an adhesive composition having high adhesion not only to a conventional polyimide or polyester film, but also to a metal substrate, and whereby high solder heat resistance can be obtained, and which also has excellent low-dielectric characteristics. An adhesive resin composition containing an acid-modified polyolefin (a), an oligophenylene ether (b) having a number-average molecular weight of 3000 or less, and an epoxy resin (c), and satisfying conditions (A) and/or (B). (A): The adhesive resin composition contains more than 20 parts by mass and no more than 60 parts by mass of the epoxy resin (c) with respect to 100 parts by mass of the acid-modified polyolefin (a). (B): The adhesive resin composition further contains a polycarbodiimide (d).

Inventors:
SONODA RYO (JP)
MIKAMI TADAHIKO (JP)
KAWAKUSU TETSUO (JP)
Application Number:
PCT/JP2019/019658
Publication Date:
December 05, 2019
Filing Date:
May 17, 2019
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
C09J123/26; C09J11/06; C09J163/00; C09J171/12; C09J179/08; H05K1/03
Domestic Patent References:
WO2016047289A12016-03-31
WO2017029917A12017-02-23
WO2016047289A12016-03-31
WO2014147903A12014-09-25
Foreign References:
JP2016210856A2016-12-15
JP2017197597A2017-11-02
JP2014034668A2014-02-24
Other References:
See also references of EP 3719093A4
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