Title:
LOW DIELECTRIC ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/102506
Kind Code:
A1
Abstract:
Provided is a low dielectric adhesive composition containing a polyolefin resin (A), an alicyclic skeleton-containing resin (B), and an epoxy resin (C), and characterized in that at least one of the polyolefin resin (A) and the alicyclic skeleton-containing resin (B) contains a carboxyl group and/or a derivative thereof and the dielectric constant of a cured product is less than 2.5. At least the alicyclic skeleton-containing resin (B) preferably contains a carboxyl group and/or a derivative thereof. The adhesive composition has not only a low dielectric property and good adhesiveness, but also excellent thermal welding heat resistance and laser processability.
Inventors:
OKIMURA YUYA (JP)
KONDO TAKAHIRO (JP)
HIRAKAWA MAKOTO (JP)
KONDO TAKAHIRO (JP)
HIRAKAWA MAKOTO (JP)
Application Number:
PCT/JP2021/040581
Publication Date:
May 19, 2022
Filing Date:
November 04, 2021
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J123/00; B32B27/00; C09J7/35; C09J11/06; C09J123/16; C09J163/00; C09J201/02; H05K3/28
Foreign References:
| JP2020037601A | 2020-03-12 | |||
| JP2019038902A | 2019-03-14 | |||
| JP2017008189A | 2017-01-12 |
Attorney, Agent or Firm:
IDE Masatake (JP)
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