Title:
LOW DIELECTRIC COMPOSITE FILM FOR COPPER CLAD LAMINATE (CCL), AND LOW DIELECTRIC COPPER CLAD LAMINTE (CCL) COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2022/055028
Kind Code:
A1
Abstract:
The present invention relates to a low dielectric composite film for a copper clad laminate (CCL), and more specifically to a low dielectric composite film for a copper clad laminate (CCL) and a low dielectric copper clad laminate comprising same, having the benefits of having significantly low dielectric permittivity and dielectric loss, and having a significantly low coefficient of expansion whilst also having excellent mechanical properties.
Inventors:
JEONG JI HONG (KR)
CHO WOO HYUN (KR)
KIM WON SOO (KR)
KIM DU YEONG (KR)
CHO WOO HYUN (KR)
KIM WON SOO (KR)
KIM DU YEONG (KR)
Application Number:
PCT/KR2020/016692
Publication Date:
March 17, 2022
Filing Date:
November 24, 2020
Export Citation:
Assignee:
SANG A FRONTEC CO LTD (KR)
International Classes:
B32B27/36; B32B7/025; B32B7/12; B32B15/08; B32B15/20; B32B27/08; B32B27/18; B32B27/28; C08J9/42
Foreign References:
| KR910008872A | 1991-05-31 | |||
| KR20080015022A | 2008-02-15 | |||
| KR19980081168A | 1998-11-25 | |||
| JP2011051203A | 2011-03-17 | |||
| KR20160038730A | 2016-04-07 | |||
| KR20200054101A | 2020-05-19 | |||
| KR20200115972A | 2020-10-08 |
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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