Title:
LOW-DIELECTRIC FLAME-RESISTANT ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/077912
Kind Code:
A1
Abstract:
Provided is a laminate that exhibits good adhesion properties with respect to not only conventional polyimide and polyester films but also to metal substrates and low polarity resin substrates, such as LCP, and that can attain high solder heat resistance and has excellent low-dielectric characteristics and flame resistance. This laminate (Z) is obtained by stacking a resin substrate and a metal substrate with an adhesive layer therebetween, the adhesive layer comprising a carboxyl-containing polyolefin resin (A). The laminate (Z) is characterized in that: (1) the adhesive layer has a specific permittivity (εc) of at most 3.0 at the frequency of 1 MHz; (2) the adhesive layer has a dielectric tangent (tanδ) of at most 0.02 at the frequency of 1 MHz; (3) the peel strength of the resin substrate and the metal substrate is at least 0.5 N/mm; (4) the laminate (Z) has a moist solder heat resistance of at least 240°C; and (5) a laminate (X) of the adhesive layer and the resin substrate indicates VTM-0 by UL-94 standard.
Inventors:
SONODA RYO (JP)
ITO TAKESHI (JP)
MIKAMI TADAHIKO (JP)
ITO TAKESHI (JP)
MIKAMI TADAHIKO (JP)
Application Number:
PCT/JP2016/081678
Publication Date:
May 11, 2017
Filing Date:
October 26, 2016
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B15/08; B32B27/00; C09J7/10; C09J11/04; C09J123/00; C09J125/06; C09J163/00; C09J179/00; C09J201/00; H05K1/03
Foreign References:
| JP2002235061A | 2002-08-23 | |||
| JP2000104025A | 2000-04-11 | |||
| JP2000345132A | 2000-12-12 | |||
| JPH1060401A | 1998-03-03 | |||
| JP2010222408A | 2010-10-07 | |||
| JP2008111102A | 2008-05-15 | |||
| JP2011148919A | 2011-08-04 | |||
| JP2007073738A | 2007-03-22 |
Download PDF: