LOW-DIELECTRIC LOSS MULTI-LAYER POLYIMIDE FILM HAVING EXCELLENT ADHESIVE STRENGTH AND MANUFACTURING METHOD THEREFOR

Title:

LOW-DIELECTRIC LOSS MULTI-LAYER POLYIMIDE FILM HAVING EXCELLENT ADHESIVE STRENGTH AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2020/209524

Kind Code:

A1

Abstract:

The present invention provides a multi-layer polyimide film and a manufacturing method therefor, the multi-layer polyimide film comprising: a core portion comprising at least 4,4'-diamino-2,2'-dimethylbiphenyl compound-derived structure; and a skin portion, wherein the multi-layer polyimide film has a dielectric loss (Df, 10 GHz) of 0.0030 or less and an adhesive strength of 820 gf/cm or less.

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Inventors:

LEE KIL-NAM (KR)
BACK SUNG-YUL (KR)
KIM KI-HOON (KR)

Application Number:

PCT/KR2020/004029

Publication Date:

October 15, 2020

Filing Date:

March 25, 2020

Export Citation:

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Assignee:

PI ADVANCED MAT CO LTD (KR)

International Classes:

B32B27/28; B32B15/08; B32B27/08; B32B37/15; C08G73/10; C08J5/18; C08L79/08; H05K1/03

Foreign References:

KR20130027442A	2013-03-15
KR20140025573A	2014-03-04
JP2004209680A	2004-07-29
JPH08244168A	1996-09-24
KR20130063592A	2013-06-17

Attorney, Agent or Firm:

HANYANG PATENT FIRM (KR)

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