Title:
LOW-DIELECTRIC POLYIMIDE FILM WITH IMPROVED DIMENSIONAL STABILITY AND METHOD FOR PREPARING SAME
Document Type and Number:
WIPO Patent Application WO/2022/108265
Kind Code:
A1
Abstract:
The present invention provides a low-dielectric polyimide film with excellent dimensional stability and heat resistance, comprising a block copolymer comprising: a first block obtained by means of an imidization reaction between a dianhydride component comprising biphenyl-tetracarboxylic acid dianhydride (BPDA) and a diamine component comprising paraphenylenediamine (PPD); and a second block obtained by means of an imidization reaction between a dianhydride component comprising benzophenone tetracarboxylic dianhydride (BTDA) and pyromellitic dianhydride (PMDA) and a diamine component comprising m-tolidine.
Inventors:
BACK SUNG-YUL (KR)
CHO MIN-SANG (KR)
LEE KIL-NAM (KR)
CHO MIN-SANG (KR)
LEE KIL-NAM (KR)
Application Number:
PCT/KR2021/016602
Publication Date:
May 27, 2022
Filing Date:
November 15, 2021
Export Citation:
Assignee:
PI ADVANCED MAT CO LTD (KR)
International Classes:
C08J5/18; B32B15/08; B32B27/08; B32B27/28; C08G73/10
Foreign References:
| KR950007999A | 1995-04-15 | |||
| KR20190116725A | 2019-10-15 | |||
| JP2016188298A | 2016-11-04 | |||
| KR20190116724A | 2019-10-15 | |||
| KR20160076879A | 2016-07-01 |
Attorney, Agent or Firm:
HANYANG PATENT FIRM (KR)
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