LOW-DIELECTRIC RESIN COMPOSITION, LOW-DIELECTRIC RESIN METAL COMPOSITE MATERIAL AND PREPARATION METHOD THEREFOR, AND ELECTRONIC EQUIPMENT

WIPO Patent Application WO/2018/196539

A1

Disclosed in the present invention are a low-dielectric resin composition, a low-dielectric resin metal composite material and a preparation method therefor, and an electronic equipment. On the basis of 100% by weight of the resin composition, the resin composition comprises: 45-70 wt% of matrix resin, 20-45 wt% of chopped glass fiber, 1-3 wt% of toughened resin, 0.2-0.5 wt% of unmodified glycidyl methacrylate, and 0-10 wt% of assistant; the matrix resin is selected from PBT resin and/or PPS resin; and the chopped glass fiber has a dielectric constant of 4.0-4.4 under 1MHz. In the case of the same matrix resin composition, the dielectric constant and the dielectric loss of the low-dielectric resin material prepared from the low-dielectric resin composition are obviously reduced, thereby facilitating satisfying the use requirements of the electronic equipment having a metal housing for plastics of an antenna channel so as to improve the signal receiving and transmitting capability of the antenna of the electronic equipment.

WO/1999/011710	THERMOPLASTIC POLYURETHANE ADDITIVES FOR CHAIN EXTENSION AND REACTIVE EXTRUSION
JP5422866	A compatibilizer composition, a thermoplastic resin composition using the same, and a method for producing the same.
JPH06305102	MULTILAYER RESIN CONTAINER

GONG QING (CN)
ZHOU WEI (CN)
ZHANG XIONG (CN)
YU YUE (CN)
SHI RENLAN (CN)

PCT/CN2018/080863

November 01, 2018

March 28, 2018

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BYD CO LTD (CN)

C08L67/02; C08L81/02

CN104403314A	2015-03-11
CN105001638A	2015-10-28
US5444124A	1995-08-22
JP2007217679A	2007-08-30

See also references of EP 3617271A4

UNITALEN ATTORNEYS AT LAW (CN)

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